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XZZ L2023 Intelligent Desoldering Station
$153,90 Le prix initial était : $153,90.$137,70Le prix actuel est : $137,70.
MECHANIC IT3 PRO INTELLIGENT TEMPERATURE CONTROL PREHEATING PLATFORM FOR IPHONE X-13 SERIES
$145,80 Le prix initial était : $145,80.$129,60Le prix actuel est : $129,60.
Catégorie : OUTIL DE RÉPARATION
Description
- Used for iPhone motherboard layered and fitting, tin planting, BGA desoldering, IC glue removal, dot matrix Face ID repair, rear camera repair
- Intelligent adjustable temperature, modular design
- No air gun and no soldering iron, just plug and use
- Multiple combination modules, good scalability, easy to expand new modules.
- Host size: 12*14cm
- Voltage 110V/220V
- Layering, tin planting, bonding, desoldering, and glue removal is integrated, and it is equipped with controllable temperature/module expansion design / no air gun and no soldering iron I plug and play technology
- Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points
- No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
- Modular design, multiple combination modules, good scalability, easy to expand new modules
- Plug and play technology, the device supports hot-swap, making your work more efficient
- Suitable for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini/13/13 Mini/13 Pro/13 Pro Max
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BGA221 BGA153
Description:
6-IN-1 BGA Reballing Stencil Template BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 EMCP EMMC BGA Reballing Stencil Kits, 6-IN-1 BGA Reballing Stencil Template for BGA/EMCP/EMMC IC,
BGA153/162/169/186/221/254 font bga reballing stencils, with ventilation hole, prevent bulges and avoid hump on the BGA Reballing Stencil Template.
High temperature resistant, top steels BGA Reballing Stencil Template for BGA153/162/169/186/221/254 EMCP EMMC
list details:
1 x 6-IN-1 BGA Plant tin net


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