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Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform For iPhone X-15 Pro Max Motherboard Rework Tin Mesh Template Fixture
Le prix initial était : $43,74.$40,50Le prix actuel est : $40,50.
iRepair MS1 Soldering Pre-Heating Station For IPhone X-14Pro Max Intelligent Desoldering Platform Motherboard Disassembly Repair
Le prix initial était : $194,40.$162,00Le prix actuel est : $162,00.
No.8063 High Quality Precision Screwdriver Suitable For iPhone 12/13/14 Pro Max And Samsung Mobile Phones
Le prix initial était : $24,30.$19,44Le prix actuel est : $19,44.
No.8063 High Quality Precision Screwdriver Suitable For iPhone 12/13/14 Pro Max And Samsung Mobile Phones
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BGA221 BGA153
Description:
6-IN-1 BGA Reballing Stencil Template BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 EMCP EMMC BGA Reballing Stencil Kits, 6-IN-1 BGA Reballing Stencil Template for BGA/EMCP/EMMC IC,
BGA153/162/169/186/221/254 font bga reballing stencils, with ventilation hole, prevent bulges and avoid hump on the BGA Reballing Stencil Template.
High temperature resistant, top steels BGA Reballing Stencil Template for BGA153/162/169/186/221/254 EMCP EMMC
list details:
1 x 6-IN-1 BGA Plant tin net
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