-25%
qianli icopy plus v2.1
Original price was: 60.000,00fcfa.50.000,00fcfaCurrent price is: 50.000,00fcfa.
UMT DONGLE
Original price was: 75.000,00fcfa.65.000,00fcfaCurrent price is: 65.000,00fcfa.
BGA221 BGA153
Original price was: 20.000,00fcfa.15.000,00fcfaCurrent price is: 15.000,00fcfa.
Description:
6-IN-1 BGA Reballing Stencil Template BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 EMCP EMMC BGA Reballing Stencil Kits, 6-IN-1 BGA Reballing Stencil Template for BGA/EMCP/EMMC IC,
BGA153/162/169/186/221/254 font bga reballing stencils, with ventilation hole, prevent bulges and avoid hump on the BGA Reballing Stencil Template.
High temperature resistant, top steels BGA Reballing Stencil Template for BGA153/162/169/186/221/254 EMCP EMMC
list details:
1 x 6-IN-1 BGA Plant tin net
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