Description





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Packing Size & Gross Weight: Compact & Lightweight,At just 240g and with a compact packing size, this test stand is easy to handle and transport for on-the-go repairs.
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Product Function: Main Board Detection & Tin Planting,Designed for both main board detection and tin planting, this stand is a versatile tool for iPhone repair professionals.
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Iphone 12 Instructions|Developer Site Apple|Material: Aluminum Alloy,Crafted from durable aluminum alloy, this test stand ensures longevity and stability for your iPhone repairs.
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Applicable Environment: Electrical DIY Supplies,Ideal for electrical DIY enthusiasts, this test stand is perfect for iPhone repairs and maintenance.
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Brand: MEGA-IDEA,Trust in the quality of MEGA-IDEA's 8in1 motherboard layered test stand for reliable iPhone diagnostics.
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BGA221 BGA153
Description:
6-IN-1 BGA Reballing Stencil Template BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 EMCP EMMC BGA Reballing Stencil Kits, 6-IN-1 BGA Reballing Stencil Template for BGA/EMCP/EMMC IC,
BGA153/162/169/186/221/254 font bga reballing stencils, with ventilation hole, prevent bulges and avoid hump on the BGA Reballing Stencil Template.
High temperature resistant, top steels BGA Reballing Stencil Template for BGA153/162/169/186/221/254 EMCP EMMC
list details:
1 x 6-IN-1 BGA Plant tin net


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