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Relife RL-601T accessory repair motherboard planting middle layer 22 in 1 iPhone X up to iPhone 15 Pro Max
Le prix initial était : $97,20.$81,00Le prix actuel est : $81,00.
RELIFE 22 In 1 IPhone X-14 15 Pro Max Middle Layer Tin Planting Set
— Precise positioning
— Fast tin planting
— Strong magnetic adsorption
— High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
Produits similaires
BGA221 BGA153
Description:
6-IN-1 BGA Reballing Stencil Template BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 EMCP EMMC BGA Reballing Stencil Kits, 6-IN-1 BGA Reballing Stencil Template for BGA/EMCP/EMMC IC,
BGA153/162/169/186/221/254 font bga reballing stencils, with ventilation hole, prevent bulges and avoid hump on the BGA Reballing Stencil Template.
High temperature resistant, top steels BGA Reballing Stencil Template for BGA153/162/169/186/221/254 EMCP EMMC
list details:
1 x 6-IN-1 BGA Plant tin net
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