YCS-H03 Universal Motherboard Circular Fixture PCB Soldering CPU IC Chip Glue Tin Removal Repair Clamp

Product Features :-

• Fully applicable to various types of chips/motherboards
• Removal tin and glue, no need to adjust the direction, travel coaxial movement
• For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
• Motherboard cleaning doesn’t require adjusting the orientation, clean up at once
• The module is suitable for various sizes of motherboards in all aspects